Vacuum Metallizer Machine (Magnetron Sputtering Type)

Vacuum Metallizer Machine (Magnetron Sputtering Type)
Vacuum Metallizer Machine (Magnetron Sputtering Type)
Vacuum Metallizer Machine (Magnetron Sputtering Type)
Vacuum Metallizer Machine (Magnetron Sputtering Type)
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  • Vacuum Metallizer Machine (Magnetron Sputtering Type)
  • Vacuum Metallizer Machine (Magnetron Sputtering Type)
  • Vacuum Metallizer Machine (Magnetron Sputtering Type)
  • Vacuum Metallizer Machine (Magnetron Sputtering Type)
  • Introduction
  • Feature
  • Specification
  • Video
    • Commodity name: Vacuum Metallizer Machine (Magnetron Sputtering Type)

    Magnetron Sputtering vacuum metallizer machine is utilized to produce flexible...

    Magnetron Sputtering vacuum metallizer machine is utilized to produce flexible copper clad laminate, window film, solar control film, high-end holographic film and other security printing material through magnetron sputtering technology to sputter and deposit Titanium, Chrome, Gold, Silver, Copper, Aluminum and other formable metal on PET, PC, PI film for anti-counterfeit industry, electronics industry, aerospace industry and automobile industry.

  • 1. Magnetron sputtering technique is suitable for any material, especially those with a high melting point which would be difficult to melt in a normal vacuum deposition system.

    2. It is often used to coating entire surfaces because it is difficult to control where the material goes.

    3. Minimum waste for raw material, reduce production cost.

    4. Adhesion is the most excellent under the support of plasma treatment.

    5. Metal, non-metal and oxides all can be sputtered out and deposited on the substrate.

    6. DC, MF and RF power supply can be selected as per various technical requirement.

  • Model

    JM500

    JM1350

    JM1800

    JM2500

    Max width(mm)

    500

    1350

    1800

    2500

    Roll diameter

    500-800mm

    Target quantity

    Customized as per technical requirement

    Service pressure

    8*10-3Pa

    Circulation water

    20m3/h

    35m3/h 40m3/h 50m3/h

    Power consumption

    Depends on sputtering power supply quantity

    Substrate

    PI, PC, PET 25-150um

    Pump system

    Mechanical pump + Roots Pump + Molecular pump + Cryogenic

    Running speed

    5-100m/min

Events

36th CHINAPLAS

2025-02-24

Date: April 15-18, 2025 Booth No.: 3Hall W85 Address: Shenzhen World Exhibition & Convention Center

Contact us

No.3 Tianhong Road, Western Park,High-Tech Zone,Chengdu, Sichuan, China

Product inquiry

providing customers with a full set of technical and product solutions including vacuum application equipment,

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